EMMC153 EMMC169 Flip Shrapnel to SD Interface Test Socket Recording Socket for Data Recovery Mobile Phone Repair
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Warranty
Warranty
All our items are new and come with a 3-year warranty under current law.
Shipping Conditions
Shipping Conditions
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We handle three types of shipping:
SHIPPING 24/48 HOURS: 1 TO 2 DAYS
STANDARD SHIPPING: 7 TO 10 DAYS
EXPRESS SHIPPING (DHL): 3 TO 5 DAYS (POSSIBLE CUSTOMS COSTS)
Depending on the destination country and item type, all or only one or two shipping options may be available.
Delivery times are approximate and may be affected by specific or unusual times. A refund may only be requested if the item has not been received within 30 days of payment.
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Description
Description
2. Interface type: SD
3. Application: Integrated circuit IC
4. Test method:
A. Select the boundary frame that matches the IC and place the flat IC into the SOCKET according to the direction
B. Insert the SD interface into the card reader and then connect to the computer, select the corresponding test program
characteristics:
1. SOCKET supports ball and non-ball testing, and the IC limit frame is replaceable. Compared with similar products, it has a long service life and wide versatility.
2. Compatible with 169-FBGA and 153-FBGA at the same time
3. The shrapnel is made of imported beryllium copper by high-precision stamping, and the head shape is imitated by the probe design, and the latter is hardened and thickened with gold plating to ensure the stability and durability of the product.
4. The contact module adopts an overall structure to reduce the problem of repeated positioning, ensure its contact point is accurately aligned with the IC PAD, and have a high pass rate in one test.
5. Use a welding structure to ensure good contact and stable testing.
6. Flip cover structure, more convenient for manual testing, convenient and simple operation
7. The pressure IC adopts an integral mold molding and a self-adaptive spring structure to ensure that ICs of different thicknesses do not require any adjustment to achieve good contact. The tested ICs are versatile (the thickness range can be tested from 0.6 to 2.0 mm).
8. The structure adopts injection molding, precise positioning, convenient access to IC and higher work efficiency.
Repair and maintenance:
1. Use an air gun or anti-static brush to remove impurities from the SOCKET seat to make it contact well;
2. Clean the SOCKET with absolute alcohol to clean the impurities stuck on the top of the shrapnel and make it fit well;
3. If you find that the shrapnel inside the PLUG is burned or broken, please purchase the corresponding PLUG to replace it;
4. Cannot detect when USB interface is connected. Check whether the power switch is on or whether the computer's USB connection is normal;
5. It is strictly forbidden to soak and clean with organic solvents such as diluted water and board washing water to avoid damage to the internal structure of the SOCKET;
6. When not in use for a long time, seal it with an anti-static bag to prevent dust from falling in and affecting the product's test performance.
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